3D SPI by Koh Young

3D SPI by Koh Young

With the combination of best technology, easy operation and a SPC-analysis software with many features, Koh Young sets the standard in 3D solder paste inspection: the system completely measures the solder paste in 3D and reliably detects all types of errors. Thanks to the broad possibilities for evaluation and analysis as well as to the possibility to interconnect all Koh Young systems, SPI systems made by Koh Young do not only improve your quality, but also your process. 

INLINE 3D SPI

The inline-systems can easily be integrated into the production line and thus increase the process accuracy. With its reliable inspection results the SPI helps to identify weak points in the printing process. 

Solder bridges

Ideal Solder: Too little volume

Ideal Solder: Too much volume

Form error

  • Highly precise 3D measurement

    • Compensation of PCB warpage
    • Multi-Frequency Moiré Technology
    • Shadow-free 3D measurement through 2-/4-way white light projection
    • Evaluation based on measured values and clear process windows

  • Statistical process control

    • Offers a wide range of analysis tools and export functions at product, component and pad level
    • Group analyses can be performed based on individually definable criteria
    • Access to measurement data and images of all depots
    • Enables precise conclusions to be drawn about the causes of defects and the printing process to be optimized

  • Configurable Stop

    • Individual definition of undesired states that trigger the configurable stop
    • Automatic interlocking as soon as the defined condition occurs
    • The operator is informed about the interlocking with an error message

  • Koh Young Process Optimizer (KPO)

    • Automatic control and improvement of the printing process
    • Determination of the ideal print parameters based on the measurement data of the SPI on the basis of artificial intelligence 
    • Automatic implementation of the ideal print parameters
    • The ideal parameters determined by the operator are maintained
    • Realization of adjustments to the printing process via three optimization modules in real time

  • Bareboard-Teaching

    • Tool for determining the exact solder paste volume taking into account the height difference between pad and solder resist 

  • Character recognition

    • Optimal recognition of characters, structures or for the detection of foreign materials through RGB and infrared illumination
    • Reliable measurement results in true colors independent of the color of the PCB

  • Auto-Repair

    • To avoid soldering defects due to insufficient paste application: Simply redispens with Koh Young Auto Repair

  • Process optimization

    • The KSMART tools turn an SPI into a tool for process control and optimization.
    • The machine states of Koh Young equipment, the status of production, and much more are stored centrally on the KSMART server
    • Detailed error reports can be viewed and managed
    • Conclusions about the entire production, targeted interventions in the process and optimizations become possible

  • Shadow-free measurement

    • Shadow elimination using multi-way projection: The inspection images are captured from 2 to 4 different angles depending on the model

3D INSPECTION SYSTEMS FOR THE BEST PROCESS RESULT

aspire3

The aSPIre3 provides outstanding measurement and repeatability required for measuring 03015M components in high volume production. aSPIre3 sets the standard in solder paste inspection by overcoming challenges such as shadowing, reflections and PCB warpage.


  • Camera resolution of up to 10µm
  • FoV: up to 61mm x 46mm
  • Inspection speed of up to 58.5cm2 /Sek 
  • PCB size: up to max. 830mm x 690mm

8030-3

This system impresses with its combination of throughput and speed: the system is twice as fast as its predecessor and loses nothing in terms of measuring accuracy. 


  • Camera resolution of up to 10µm
  • FoV: up to 56mm x 57mm
  • Inspection speed of up to 91,2cm2 /Sek 
  • PCB size: up to max. 850mm x 690mm

8030-2

Equipped with patented Moiré technology and 2-way projection, the system masters shadows and reflections without compromising measurement accuracy. 


  • Camera resolution of up to 10µm
  • FoV: up to 50mm x 50mm
  • Inspection speed of up to 59,5cm2 /Sek 
  • PCB size: up to max. 850mm x 690mm

KOH YOUNG im VIDEO

Discover the Koh Young 3D SPI and our customers' testimonials in the video. Linked to the right you will find our entire playlist on the topic of "Koh Young SPI".

This button will take you to all videos of the playlist

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