Laser-depaneling technology
Laser depaneling is a cutting-edge technology. Prejudices that the laser would burn the PCB and also is very expensive are already obsolete today.
The high cutting quality, achieved with the patented
CleanCut technology by LPKF, even improves both quality and lifespan of the final product. Moreover, laser depaneling opens up numerous potentials for optimizations that a conventional mill could never offer.
HOW IT WORKS
THE CUTTING PROCESS
Step 1
The separation process starts with a point ablation using a pulsing laser beam.
Step 2
The laser beam is deflected along the XY axis. Line by line, the PCB material is evaporated without leaving any residue.
Step 3
The laser beam is repeatedly deflected along the XY axis, with some material being worn off the PCB in each pass.
Step 4
The PCB is separated cleanly.
Technology
CleanCut and Tensor: LPKF presents new technologies that push the boundaries of laser depaneling and open up a broader range of applications for depaneling via laser.
Learn more here.
CLEANCUT-TECHNOLOGY
For cutting edges free from carbonization
The patented CleanCut technology from the manufacturer LPKF reduces carbonization at the cut edges to zero and thus increases the service life of printed circuit boards. Since the materials fuse during the cut, fraying of the cut edges is prevented. The high cut quality also reduces process costs: no cleaning steps are required.
TENSOR-TECHNOLOGY
Highest cutting quality, even with powerful laser sources
Tensor technology, the latest patented ultrafast beam delivery technology from LPKF exceeds the limits of conventional laser depaneling solutions: Where in other systems powerful laser sources lead to quality losses due to heat generation and to long cooling times, Tensor moves the laser beam in a targeted and ultra-fast manner. The heat of the laser is thus distributed and 100% technically clean cutting edges and highest cutting speeds can be achieved even with powerful laser sources.
